Macronix provides Known Good Die (KGD) products for custom System in Package (SiP) solutions requiring small form factor Flash memory. Our KGD products are ideal for diverse applications, such as portable consumer electronics, set-top box, DSC, mobile phones, IoT/wearable devices, automotive devices, GPS, tablets, industrial, networking…etc.
Macronix would apply its stringent process for qualification, testing, extended temperature support and packaging to its line of KGD products, and is committed to delivering:
Note: Top metal scheme of WJ is better than WG for wire bonding.
Please contact your local Macronix sales person for the most suitable solutions that meet your needs.
Macronix WLCSP is a true chip-scale package, offering an extremely small footprint. It is the ideal solution for mobile or portable form factor applications, such as mobile phones, tablets, digital cameras, smart watches, bluetooth headsets, and GPS navigation devices.