Possessing a small chip size, the Wafer-Level Chip Scale Package (WLCSP) solution is one of the most cost-effective and space-efficient packaging options in the industry.

Macronix WLCSP is a true chip-scale package, offering an extremely small footprint. The key advantages include:

• Low chip-to-PCB inductance
• Reduced package size
• Enhanced thermal conduction

Macronix WLCSP Solutions

Please contact your local Macronix sales person for the most suitable solutions that meet your needs.